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Description

Number of Layers 2layer 4layer-10layer
Copper Thickness 0.5-4 oz 0.5-4 oz
Base Board Thickness 0.2-4.0 mm 0.4-5.2 mm
Incombustibility 94V - 0 94V - 0
Peelable resistance 12.3N/cm 12.3N/cm
Twist  ≤0.5% ≤0.5%
Insulation resistance 10(11 10(11
Test voltage 100DCV 100-200DCV
Finished board area 560*610mm 560*610mm
Min. Line Width and Spacing 0.1/0.1mm 0.1/0.1mm
Copper thickness in hole ≥25.0um ≥25.0um
Mini. pad diameter Inner layer   0.5mm
Out layer 0.076mm 0.076mm
Mini. Hole Diameter 0.25mm 0.20mm
Hole tolerance PTH ±0.076mm ±0.076mm
NPTH ±0.05mm ±0.05mm
Hole location tolerance ±0.076mm ±0.05mm
profile tolerance CNC Routing ±0.01mm ±0.01mm
Punching ±0.013mm ±0.013mm
Solder mask bridge ability ≥0.1mm ≥0.1mm
Solder mask rigidity 6H 6H
Solderable test 245℃ 5second 245℃ 5second
Thermal cycling ability 288℃ 10second 288℃ 10second
Surface Finishing OSP,HAL,Immersion AU,Soft Au Plating,Gold Finger  OSP,HAL,Immersion AU,Soft Au Plating,Gold Finger 
Qaulity standard IPC-A-600F,IPC-ML-950 IPC-A-600F,IPC-ML-950

Place of Origin China [CN] Currency
Payment Method Minimum Order
Delivery Time Delivery with in 7days
Packaging Supply Ability
Contact Info
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