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Home » For Buyers » Products » Computer & IT » Hardware Components » CPU
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Description

Silicone Rubber Thermally Conductive Insulation Pad has an ideal filler blend that gives low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance. Application: Computer and peripherals ·Telecommunications ·Power conversion ·RDRAMTM memory modules/chip scale packages ·Area where heat needs to be transferred to a frame, ·chassis, or other type of heat spreader Specification: Thickness 0.5.mm1mm1.5mm2mm2.5mm3.0mm3.5mm4.0mm4.5mm.5.0mm. Note: color and back adhesive can be optional by customers. Application: it can be applied in a variety kind of electronics for heat radiation and insulation, such as: CD-ROM, computer, power supplier, LED etc. Physical Property Unit Data Test Way Thickness mm 0.5-5 ASTMD374 Specific Gravity g/gg 1.6 ASTM D 729 Hardness Shore A HA 10-40 ASTM D2240 Flammability class V-0 UL-94 Breakdown Voltage KV 4.5KV↑ ASTM D 149 Volume Resistivity Ω.CM 1011Ω↑ ASTM D257 Thermal Conductivity W/m-K 2.5 ASTM 5470 Continuous Use Temp 60 ~ 200 Thermal Impedance Per -in2/w 5.5 ASTM 5470

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Contact Info
  • Company Name:
  • Business Type:
    Manufacturer, Exporter,
  • Member Since:
    1999
  • Contact Person:
    Jack Cao
  • Country:
    China [CN]
  • Company Address:
    No 2 Dontai Road Hengdongling Industrial area Bainikeng Community Pinghu Street
  • Phone Number:
    86-755-89696986
  • Fax Number:
    86-755-89696555
  • MSN:
  • Website:

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