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GBZ-1321 Encapsulated Adhesive

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Item specifics

Product name: GBZ-1321 Encapsulated Adhesive

Product Description

1. Performance:
* Single component, can be used conviniently.
* Excellent insulation performance and good adhesion.
* Excellent oil, high-temperature, chemical resistance performance.
* Curing under room temperature.

2. Typical usage
* Hybrid integrated circuit
* Electronic circuit
* Flexible printed circuit
* Semiconductor crystal of line protection
* the car of electronically control panel
* the panel of aircraft instrumentation
* Microcomputer control
* Electronic control system
Currency: USD
Unit Price:
Quantity:
Delivery:

Send your inquiry to this supplier

From: Please enter the email.
To:

Mrs. Jay ZhouShenzhen Ju Ren Cheng Electronic Material Co.,Ltd

  • Tel:86-755-27838545Fax:86-755-27838545Mob:
Subject: Inquiry about PCB
Message:
Code: Refresh

PCB Supplier

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